Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module. Frattura ed Integrità Strutturale, [S. l.], v. 15, n. 55, p. 316–326, 2020. DOI: 10.3221/IGF-ESIS.55.24. Disponível em: https://ww3.fracturae.com/index.php/fis/article/view/2941. Acesso em: 12 nov. 2024.