Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation . Frattura ed Integrità Strutturale, [S. l.], v. 14, n. 51, p. 541–551, 2019. DOI: 10.3221/IGF-ESIS.51.41. Disponível em: https://ww3.fracturae.com/index.php/fis/article/view/2663. Acesso em: 12 nov. 2024.